Responsibilities

• Engaging directly with customers, material suppliers, industry partners, and market influencers to understand emerging technology trends, customer requirements, and market opportunities within advanced packaging and substrate manufacturing.
• Developing product positioning, messaging, and value propositions that clearly differentiate Geode A and Geode X solutions and communicate customer value.
• Managing product pricing, profitability, and business performance to support revenue growth and margin objectives.
• Supporting revenue forecasting, demand planning, and quarterly production planning activities to align business objectives with operational execution.
• Leading the marketing and commercial aspects of strategic customer negotiations, including product positioning, pricing strategies, business cases, and long-term commercial agreements.
• Monitoring, analyzing, and reporting competitive intelligence, market dynamics, technology trends, and customer adoption patterns to support strategic decision-making.
• Developing and maintaining multi-year product roadmaps aligned with customer roadmaps, market trends, competitive dynamics, and company growth objectives.
• Leading marketing requirements development for new products and enhancements through the creation of Marketing Requirements Documents (MRDs) and close collaboration with Engineering teams throughout the New Product Introduction (NPI) process.
• Managing the full product lifecycle, including new product introduction, portfolio optimization, product upgrades, end-of-sale planning, and end-of-life execution.

Requirements

• Bachelor's degree in Engineering, Physics, Business, Marketing, or a related technical discipline. Master's degree preferred.
• 10+ years of job-related work experience.
• Experience in product marketing, product management, business management, or strategic marketing for semiconductor capital equipment, advanced packaging equipment, PCB manufacturing equipment, or related high-technology capital equipment industries.
• Demonstrated experience managing product strategy, roadmaps, pricing, forecasting, and product lifecycle management.
• Strong commercial acumen with experience supporting customer negotiations, business case development, and profitability analysis.
• Ability to translate market and customer requirements into actionable product requirements and strategic investment recommendations.
• Travel Requirements: Up to 25% international travel is required.

Preferred

• Experience supporting advanced packaging, IC substrate, FC-BGA, advanced FC-BGA, heterogeneous integration, HBM, or AI-related packaging applications.
• Experience with semiconductor capital equipment, process equipment, or electronics manufacturing equipment.
• Knowledge of substrate manufacturing processes, PCB fabrication, and advanced packaging technologies.
• MBA or advanced technical degree.
• Experience working directly with global customers throughout Asia, North America, and Europe.