Responsibilities

• Responsible for the strategy and marketing of Patterning Materials including Electron Inks products in Advanced Packaging applications.
• Competent in developing market intelligence for advanced packaging materials market, updating assessments of Market size, competitive position, market trends, working with GMMs for Photoresists, Cleans, other patterning products, as applicable.
• Through technical expertise, identify and stay ahead of key High Performance Packaging (Advanced Packaging) technology inflection points and roadmaps.
• Through industry/ecosystem connections continue to acquire in-depth strategic knowledge of customer and OEM roadmaps.
• Leverage industry network and connections to engage the ecosystem on collaborative development opportunities.
• Leverage deep technical knowledge to ensure development programs are identifying and meeting industry standard datasets.
• Ensure development programs are leveraging industry expertise to deliver relevant datasets in the timeliest manner.
• Co-Lead opportunity management of Thick Film Resist, SP&C products and other patterning products used in Advanced Packaging working closely with Sales and Applications teams.
• Work closely with the GMM Innovation- Photoresist to implement the PFAS free portfolio; Cleans, and other patterning products relevant to advanced packaging.
• Represent EMD Electronics in industry related conferences.

Requirements

• Bachelor's degree in chemistry, marketing, business, or a related field.
• 5+ years of experience in the semiconductor industry, with a strong knowledge/experience in High-Performance Packaging (advanced packaging) technologies.
• Demonstrated ability to collaborate effectively across functions and cultures within a complex matrix organization.
• Inspiring leadership skills, with the ability to motivate teams and drive projects forward.
• Demonstrated ability to uncover underlying customer and supplier needs through effective questioning and active listening.

Preferred

• Advanced degree, such as an MBA or PhD.
• 8+ years of direct working experience in the field of advanced packaging.
• Strong communication skills, with the ability to positively influence cross-functional teams and peers.
• Deep technical understanding of state-of-the-art advanced packaging technologies.
• Self-starter, ability to operate with little direction.

Benefits

• Benefits offered by the Company include health insurance, paid time off (PTO), retirement contributions, and other perquisites.