Responsibilities

• Develop and deliver technical marketing materials such as videos, presentations, and lab/demo content for Advanced IC Packaging solutions.
• Build and demonstrate solution workflows for 2.5D and 3DIC design by connecting multiple tools, including planning, layout, and verification tools, using Tcl and Python.
• Engage customers in technical discussions to understand design challenges, workflow gaps, and use-case requirements.
• Translate customer technical requirements and related business needs into actionable input for development teams.
• Understand newly developed products and enhancement features, and communicate their technical value and applicability to customers.
• Support the definition and evolution of solution concepts that address current and future customer workflows.
• Collaborate with internal teams across product, development, and field organizations to align solutions with market needs.
• Understand the goals of each assigned project and the role expected within that project.
• Proactively drive assigned responsibilities to support successful project execution and achievement of business objectives.
• Take ownership of deliverables and contribute effectively in project-based activities.

Requirements

• Native or near-native proficiency in English.
• 5+ years of relevant experience in 2.5D / 3DIC design, Advanced IC Packaging, or technically supporting such flows from an EDA perspective.
• Strong understanding of design workflows spanning planning, layout, and verification.
• Practical scripting experience using Tcl and Python to automate or integrate workflows across multiple tools.
• Ability to engage directly with customers in technical discussions and help define solution use cases.
• Ability to use Linux as an end user in a business or technical environment.
• Proficiency in Microsoft Office products for business use.
• Formal academic background in Electrical Engineering, Electronics, or a related technical field.

Preferred

• Experience in technical marketing, application engineering, solution engineering, or other customer-facing technical roles.
• Experience creating technical demonstrations, proof-of-concept workflows, or presentation materials.
• Familiarity with EDA solution positioning for semiconductor or packaging design customers.
• Interest in emerging workflow technologies, including AI- or agent-assisted solution approaches.